EMFA-26-678 Cu/Ag Conductron® is a solvent reducible copper/silver conductive coating. It was formulated to provide Electro Magnetic Interference and Radio Frequency Interference (EMI/RFI) Shielding properties.

This product provides excellent conductivity at low film thickness along with good mar resistance and adhesion to most plastic and plastic blends used in the electronics industry.

Performance Properties:
Resistance @
1 mil: <0.1 ohms/sq.
Gloss: Flat
Adhesion: Good to Excellent
Mar resistance: Excellent

Application:

Apply: Spray; HVLP, Air, Air Assisted Airless, etc.
Reduction: As required
Reducer: MEK
Substrate: Plastic
Wet Film: 4 - 9 mils (2 passes may be required)
Dry Film: 0.5 - 2.0 mils

Specifications:

VOC: 6.35 lbs/gal
Viscosity: 18 - 24 sec
Viscometer: #2 Zahn
Weight/gal: 8.96 - 9.16 lbs
Flash Point: 24° F TCC
Solids by wt: 28.77 - 30.77%
Solids by vol: 11.10 - 13.10%
Coverage @ 1 mil: 200 ft²
100% efficiency

Cure Rate:

Air Dry: 2 hours @ 77° F
Bake: Air dry 15 min then bake 15 min @160° F

The above technical data is accurate to the best of our knowledge. No warranty is expressed or implied as application methods and conditions and intended use is beyond our control.